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Rich Sphere Precision 
Industry Co.,Ltd.
Country/Region:Taiwan, New Taipei

Address:No.481, Jhongjheng 1st Rd. Yingge Dist, New Taipei City, Taiwan
Zip/Post Code:239

   Tel:886-2-26700188
 Fax:886-2-26700168
 
  • Contact Person:Becky Chin
Job Title:Manager
 E-mail:richsp@richsp.com.tw
 
  • Contact Person:Lala Chin
Job Title:Sales Manager
 E-mail:lala.chin@richsp.com.tw
 
  • Contact Person:Carol Chen
Job Title:Sales Engineer
 E-mail:carol.chen@richsp.com.tw
 
 
 

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Patented High-Power Elevated Fin-Type Heat Sink

With the rapid growth of AI, industrial automation, and high-performance computing, thermal management is more important than ever. [Rich Sphere Precision Industry Co., Ltd.](https://www.richsp.com.tw/Fin-type-Heat-Sink-pd47168114.html?utm_source=chatgpt.com) utilizes patented non-soldering manufacturing technology to create advanced fin-type heat sinks and high tower CPU coolers that deliver outstanding thermal performance, environmental sustainability, and long-term reliability.
 
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  • Fin-type Heat Sink


Patented High-Power Elevated Fin-Type Heat Sink Technology

In high-power industrial and electronic applications, thermal management is the critical factor determining product performance and lifespan. For high-power LEDs, approximately 70-80% of electrical energy is converted into heat. If not dissipated effectively, excessive junction temperatures can lead to light decay, color shifting, and catastrophic failure. Rich Sphere Precision (RSP) offers advanced High-Power Elevated Fin-Type Heat Sink solutions featuring a patented "non-welded" process that sets new standards for lightweight, eco-friendly, and high-efficiency cooling.


Patented High-Power Elevated Fin-Type Heat Sink

1. Technical Specifications & Precision Parameters

RSP’s elevated fin-type heat sinks are engineered for extreme precision and high thermal conductivity.

Feature Detailed Specifications
Product Name High-Power LED Bonded Stitched Fin Heat Sink
Primary Material Aerospace-grade AL6063 Aluminum Alloy
Tolerance Ultra-precise 0.01mm
Fin Thickness Industry-leading 0.15mm ultra-thin design
Width 70mm
Elevated Heights 30mm, 45mm, 60mm
Surface Finish Clean + Conductive Anodizing
Origin Made in Taiwan (Yingge District, New Taipei City)

2. Core Strategic Advantages: Patented Non-Welded Riveting

The patented non-welded riveting procedure used by RSP solves the most common pain points in traditional heat sink manufacturing.

Breakthrough Weight & Material Optimization

  • Aluminum Savings: Compared to traditional aluminum extrusion, this technology saves over 40% of aluminum material.

  • Lightweight Design: The significant reduction in mass is ideal for high-power elevated lighting such as street lights and high-bay fixtures that have strict structural load requirements.

Maximized Thermal Surface Area

  • Bonded Stitched Fin Technology: This process involves bonding small, wedge-shaped fins together.

  • High Aspect Ratio: In a compact footprint, this technology creates a fin density and aspect ratio far superior to traditional extrusion, dramatically increasing the surface area for heat exchange.

Superior Thermal Interface

  • Seamless Connection: The riveting process ensures a high-pressure mechanical fit between the fins and the baseplate.

  • Efficiency: This unified structure minimizes thermal resistance at the interface, with data showing heat elimination performance that overtakes traditional aluminum extrusion.


3. Comparison: Why "Riveting" is the Superior Choice?

This table details the differences between RSP’s patented process and traditional manufacturing methods.

Comparison Dimension RSP Patented Non-Welded Riveting Traditional Soldering (Reflow) Traditional Extrusion
Environmental Impact Lowest (No plating, zero pollution) High (VOCs/chemical treatment) Medium
Material Waste Minimal (40% Al savings) Medium High
Thermal Efficiency Excellent (High density/low resistance) High (Limited by solder resistance) Baseline
Tooling Costs Low (Flexible for grooved bases) High (Solder/Reflow oven costs) Medium (Expensive molds)
High-Temp Stability High (No risk of solder aging) Medium (Long-term joint brittleness) High

4. Professional Applications for High-Power Environments

RSP’s elevated fin-type technology is widely deployed in high-heat industrial sectors:

  • High-Power LED Lighting: Street lights, floodlights, high-bay kits, and AR111/PAR lamps.

  • Telecommunications: High-end OSFP and QSFP-DD transceiver thermal modules.

  • Electronics: GPU cooling, power amplifier PCBs, and server CPU heatsinks.

  • Industrial Systems: Ultrasonic electronic equipment and high-power power supplies.


5. ESG & Environmental Sustainability

In line with global carbon reduction trends, RSP’s procedure offers significant environmental value:

  • No Plating Required: The process avoids high-pollution chemical surface treatments.

  • Energy Efficient: Production eliminates the need for high-temperature reflow ovens, drastically reducing power consumption.

  • IP Protection: Extensive patents protect our unique procedure, ensuring clients can compete globally without intellectual property concerns.


A professional heat sink is a critical component that determines the Total Cost of Ownership (TCO) and brand reputation. Rich Sphere Precision's elevated fin-type heat sinks provide a perfect balance of thermal performance, cost-efficiency, and environmental compliance through precision CNC machining and advanced bonding technology.

Contact Rich Sphere Precision (RSP):

  • Address: No. 481, Zhongzheng 1st Rd., Yingge Dist., New Taipei City, Taiwan

  • Official Website:https://tw.richsp.com.tw/

  • Contact: 886-2-26700188

Keywords: High-Power Fin-Type Heat Sink, Elevated Heat Sink, Rich Sphere Precision, Non-Welded Procedure, LED Thermal Management, AL6063, Taiwan Thermal OEM, Riveting Technology.

Fin-type Heat Sink


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Rich Sphere Precision Industry Co., Ltd.

RSP was found in 1991, and we have a great reputation and core competitive through focusing on study thermal solution and metal press skill. Through constantly improved and research, RSP has gained a core pattern technology『Non-Soldering Processing』 which has been proved is the best solution for total thermal management. This process require no soldering can not only reduce the cost of manufacture but also environmental friendly because of all the metal part can be re-use.  

Now, RSP is mainly making the LED related products, and it has fully ranges of products , from Small Mr16, Par30, Par38, Ar111. and  for the small high bay 50W to big high bay 600W heat-sink. RSP has positioned our-self as professional thermal solution provider.

Our mission is simple and straight forward which is designing best product for our customer and also be a responsible company for environmental protection.
 

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